Lead-free Electronics

766 pages | Dec 12, 2006 |ISBN:0471786179 | PDF | 33 Mb

Each chapter is written by leading experts in the field and carefully edited to ensure a consistent approach. Readers will find all the latest information, including the most recent data on cyclic thermomechanical deformation properties of lead-free SnAgCu alloys and a comparison of the properties of standard Sn-Pb versus lead-free alloys, using the energy partitioning approach.


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